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Thermal pads cut from materials such as thermal tapes, thermal coated fabrics, thermally conductive silicone (TC100), and thermally conductive silicone sponge (R-10404), to name a few, are firm as compared to gap fillers or gap pads. The thermal interface materials offered by Stockwell are designed to remove the heat generated by electronic devices to the ambient environment. Thermal management is a critical component in ensuring the reliability and proper operation of electronic and electromechanical equipment.
Gap Filler/ Gap Pads
Gap filler or Gap Pad materials are thermally conductive pads that have a "dough" like consistency. These very soft gap fillers are designed to conform to and fill in between inconsistent surfaces as well as fill microscopic voids on contact surfaces. As an example, the surface of a heat generating microprocessor and a heat sink will never mate perfectly. The air gaps between the surfaces will prohibit good heat transfer. By filling these gaps with thermally conductive materials, the heat generated by the microprocessor can be properly managed, which in turn will aid in performance and reliability. Due to the cost of gap fillers and gap pads, Stockwell takes extra effort to optimize the yield and minimizing waste.
Insulating Pads
The cellular materials that Stockwell carries have thermally insulating properties. Similar to a double paned window the small pockets of air in the cells inhibits heat transfer. The most common products used for insulating pads are silicone foam products; these are UL94-V0 rated and have an operating temperature of 392º F (200º C).
Contact Stockwell Elastomerics, Inc.
Contact Us for further assistance with thermal pads.
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