There is a new breed of personal computers on the market today, the Ultra Mobile PC. One of the obvious driving sectors for these products is the military where sensitive electronics are exposed to harsh environments. These UMPC’s or ultra rugged computers have also been used commercially in a limited capacity but with the mobile device market on a steep incline, consumers are demanding a greater level of protection for their mobile devices.

In January of 2000 the DoD released standard MIL-STD-810F which is a very comprehensive guide for Environmental Engineering Considerations and Laboratory Testing Procedures. This covers temperature, vibration, shock, EMI shielding, fluid contamination, etc…

Stockwell has been “Ruggedizing” electronics for many years. The key to achieving a truly rugged component is in the materials. For example, if a device is exposed to extreme low temperature and dropped it will rely on the cushioning pad for protection. Traditional “rubber” will firm up and pass the energy on to the internal components, ultimately leading to a device failure. A silicone foam product is a good choice for mechanical shock and vibration in extreme temperatures, silicone maintains cushioning properties below -80°F. Where fuel and chemicals may make contact with the elastomeric cushion, a closed cell fluorosilicone sponge might be the better choice.

Stockwell has a wide range of materials to meet the most demanding ruggedizing requirements, including; chemical resistant, soft sponges and foams for cushioning and damping, EMI shielding materials, open cell and closed cell products for dust and water sealing. Production capabilities include custom molding, fast-turn water jet cutting, die cutting and adhesive laminations.

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